NMOS逻辑
电气工程
放大器
前端和后端
高电子迁移率晶体管
节点(物理)
计算机科学
低噪声放大器
CMOS芯片
电子工程
工程类
晶体管
操作系统
结构工程
电压
作者
Raj Verma Purakh,Shaoqiang Zhang,Rui Tze Toh,Jen Shuang Wong,Wei Gao,Kok Wai Chew,Rajesh V. Nair,D.L. Harame,Josef Watts,Thomas McKay
标识
DOI:10.1109/rfic.2015.7337701
摘要
The cellular frequency spectrum has become increasingly complex with over 50 frequencies in LTE standards. To reduce costs in the front end module the switch has migrated from a III-V PHEMT base to a silicon solution in RFSOI. While many providers have focused on a 180nm base technology node for the RFSOI there has been an increasing move to more advanced nodes to solution the logic requirements of the cellular standards. In addition there has been a strong interest in migrating to an SOC solution in RFSOI. In this paper a 130nm RFSOI technology is presented with high performance and low noise body tied 1.5V NMOS for LNA devices with a novel method of body contacting, low Ron*Coff NMOS for antenna switch and state of the art EDNMOS with f T of 38GHz and BVdss of 14V BVdss for integrated PA application. Specific results presented include characterization of the switch, LNA, and Power Amplifier devices.
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