环氧树脂
热重分析
材料科学
差示扫描量热法
硅酮
电介质
动态力学分析
复合材料
丁香酚
扫描电子显微镜
高分子化学
聚合物
有机化学
化学
物理
热力学
光电子学
作者
Yuan Liu,Jinyue Dai,Xiaoqing Liu,Jun Luo,Shusen You,Jin Zhu,Songqi Ma,Zhen Jia
出处
期刊:Journal of Electronic Packaging
[ASME International]
日期:2017-05-24
卷期号:139 (3)
被引量:30
摘要
In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4′-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance (1H-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1 kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 °C and higher residues at 800 °C than that of DGEBA.
科研通智能强力驱动
Strongly Powered by AbleSci AI