Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes
纳米技术
制作
化学工程
作者
Hyungseok Kang,Sol Ji Song,Young Eun Sul,Byeong Seon An,Zhenxing Yin,Yongsuk Choi,Lyongsun Pu,Cheol-Woong Yang,Youn Sang Kim,Sung Min Cho,Jung-Gu Kim,Jeong Ho Cho
出处
期刊:ACS Nano [American Chemical Society] 日期:2018-04-30卷期号:12 (5): 4894-4902被引量:37
标识
DOI:10.1021/acsnano.8b01900
摘要
In this study, we developed a roll-to-roll Ag electroplating process for metallic nanowire electrodes using a galvanostatic mode. Electroplating is a low-cost and facile method for deposition of metal onto a target surface with precise control of both the composition and the thickness. Metallic nanowire networks [silver nanowires (AgNWs) and copper nanowires (CuNWs)] coated onto a polyethylene terephthalate (PET) film were immersed directly in an electroplating bath containing AgNO3. Solvated silver ions (Ag+ ions) were deposited onto the nanowire surface through application of a constant current via an external circuit between the nanowire networks (cathode) and a Ag plate (anode). The amount of electroplated Ag was systematically controlled by changing both the applied current density and the electroplating time, which enabled precise control of the sheet resistance and optical transmittance of the metallic nanowire networks. The optimized Ag-electroplated AgNW (Ag-AgNW) films exhibited a sheet resistan...