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148 积分 2024-03-09 加入
Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength
3小时前
求助中
Dicing of Thin Silicon Wafers with Ultra-Short Pulsed Lasers in the Range from 200 fs up to 10 ps
3小时前
已完结
Electrochemical grooving
3小时前
求助中
Electrochemical Grooving for Slicing Silicon Wafers Using Catalytic Wires
4小时前
待确认
Electrochemical Grooving for Slicing Silicon Wafers Using Catalytic Wires
4小时前
已关闭
Investigating flank face friction during precision micro cutting of commercially pure titanium via plunging tests with diamond grooving tools
4小时前
已完结
Femtosecond laser blackening of metals
3个月前
已完结
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