压痕硬度
材料科学
合金
位错
冶金
老化
电导率
电阻率和电导率
微观结构
复合材料
医学
化学
电气工程
内科学
工程类
物理化学
作者
Jia Zhi Li,Hua Ding,Wei Gao
出处
期刊:Key Engineering Materials
日期:2021-11-22
卷期号:904: 76-81
标识
DOI:10.4028/www.scientific.net/kem.904.76
摘要
The effect of pre-aging on properties of Cu0.24Cr0.20Sn alloy before rolling and aging was studied in details. The results displayed the pre-aging was useful to improve the microhardness and conductivity of Cu0.24Cr0.20Sn alloy before cold rolling and aging, and the effect increased with the extension of pre-aging time. The microhardness and electrical conductivity of Cu0.24Cr0.20Sn alloy by first pre-aging at 400 °C for 2 h, second 85% rolling and then aging at 300 °C for 1 h can reach 189 HV and 85.4 %IACS, respectively. The TEM results indicated the density of precipitates increased with the increase of pre-aging time, and the interaction between precipitates and dislocations was gradually strengthened in the subsequent room-temperature rolling. The increase caused by pre-aging treatment before rolling and aging was mainly due to dislocation density strengthening.
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