跨阻放大器
CMOS芯片
带宽(计算)
电子工程
逆变器
线性
数据中心
计算机科学
电气工程
噪声系数
工程类
电信
运算放大器
放大器
计算机网络
电压
作者
K.R. Lakshmikumar,Alexander Kurylak,Romesh Kumar Nandwana,Bibhu Das,Joe Pampanin,V. Boccuzzi,Pavan Kumar Hanumolu
标识
DOI:10.1109/bcicts53451.2022.10051698
摘要
An overview of Silicon Photonics and SiGe bipolar TIAs are presented for data center links. CMOS inverter-based TIA circuit topologies for high-bandwidth, low-noise, low-power, and high-linearity are discussed in brief. A design methodology to achieve the best overall receiver sensitivity is presented for a standalone TIA and a TIA codesigned with a DSP. The codesigned TIA methodology is validated using a 106.25 Gbps PAM-4 TIA prototype. Designed in a 16 nm FinFET CMOS process, the TIA with a transimpedance gain of 76 dBΩ has a range of 16 dBΩ. The TIA consumes 103.6 mW, has a -3 dB bandwidth of 18.4 GHz, an input-referred noise of 1.58 µA, and a noise density of 9.7 pA/√Hz.
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