材料科学
石墨烯
数码产品
复合材料
导电体
铝
热导率
铜
电阻率和电导率
电极
热的
电子设备和系统的热管理
机械工程
纳米技术
冶金
电气工程
工程类
物理
物理化学
气象学
化学
作者
Virat Khanna,Kamaljit Singh,Santosh Kumar,Shikha Bansal,C Manjunatha,Ing Kong,Mohammad Khalid,Vishal Chaudhary
标识
DOI:10.1149/2162-8777/aca933
摘要
Rising demands for reliable thermally and electrically conductive and stable, lightweight, and mechanically enduring materials in architecting smart electronics have accelerated the research in engineering metal-matrix composites (MMCs). Amongst all, copper (Cu) and aluminium (Al) based MMCs are popular owing to high electrical conductivity, but large heat dissipation in compact electronic gadgets is still challenging. The reinforcement of Cu/Al with graphene caters to problems of heat dissipation, strengthens mechanical endurance, and optimizes electronic and thermal conductivities as per the device architect and application. The present report systematically reviews the state-of-the-art Cu/Al MMCs using graphene reinforcement with enhanced electrical, thermal and mechanical attributes for smart electronics manufacturing. It discusses the fundamentals for optimising the electrical and thermal charge transport in Cu/Al MMCs through graphene reinforcement. Besides it discusses challenges, alternate solutions, and advanced prospects of graphene reinforced Cu/Al MMCs for smart electronics manufacturing.
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