刷子
数据清理
化学机械平面化
材料科学
摩擦学
复合材料
薄脆饼
变形(气象学)
抛光
纳米技术
工程类
废物管理
作者
Ara Philipossian,Lateef Mustapha
出处
期刊:Journal of The Electrochemical Society
[The Electrochemical Society]
日期:2004-01-01
卷期号:151 (9): G632-G632
被引量:19
摘要
Tribological attributes of post-chemical mechanical planarization (CMP) brush scrubbing process were investigated as a function of type and velocity of the brush roller, applied pressure, and the pH of the cleaning solution. Coefficient of friction (COF) results were significantly different for the two types of brush rollers over a wide range of operating conditions. The two types of rollers were subjected to a battery of dynamic mechanical analyses and shown to be identical to one another in terms of flexural storage modulus and By quantifying the extent of deformation of the entire brush roller during actual scrubbing using real-time pressure sensing technology, it became apparent that for a given applied load on the brush, the less compliant brush roller (by about 10%) resulted in proportionately higher COF, thus underscoring the importance of brush design and method of mechanical testing of the roller for imparting desired amounts of shear force on the surface of the wafer during scrubbing. © 2004 The Electrochemical Society.
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