环氧树脂
材料科学
导电体
复合材料
复合数
刚度(电磁)
共价键
胶粘剂
热的
物理
图层(电子)
量子力学
气象学
作者
Fubin Luo,Wenqi Cui,Yingbing Zou,Hongzhou Li,Qingrong Qian,Qinghua Chen
出处
期刊:Materials horizons
[The Royal Society of Chemistry]
日期:2024-01-01
被引量:2
摘要
High-power electronic architectures and devices require elastic thermally conductive materials. The use of epoxy resin in thermal management is limited due to its rigidity. Here, based on epoxy vitrimer, flexible polyethylene glycol (PEG) chains are introduced into covalent adaptable networks to construct covalent-noncovalent interpenetrating networks, enabling the elasticity of epoxy resins. Compared to traditional silicone-based thermal interface materials, the newly developed elastic epoxy resin shows the advantages of reprocessability, self-healing, and no small molecule release. Results show that, even after being filled with boron nitride and liquid metal, the material maintains its resilience, reprocessability and self-healing properties. Leveraging these characteristics, the composite can be further processed into thin films through a repeated pressing-rolling technique that facilitates the forced orientation of the fillers. Subsequently, the bulk composites are reconstructed using a film-stacking method. The results indicate that the thermal conductivity of the reconstructed bulk composite reaches 3.66 W m
科研通智能强力驱动
Strongly Powered by AbleSci AI