P‐37: Design and research of thermal soaking scheme for COG display module

Glass direct current product USES the uA level, LED chip light‐emitting efficiency under different temperature differences. Because of the glass substrate, high thermal conductivity, glass and metal bracket assembled light board, due to the contact position and not contact position Z to thermal resistance difference is bigger, results in a larger temperature difference in the surface, lead to white picture, stimulation and phenomenon of tic‐tac‐toe grid. Analyze the lamp plate heat source, according to the thermal distribution of different location, by adopting insulation tape, multilayer graphite flake scheme improve lamp plate to the heat conduction ability, X/Y for COF package IC and light insulating board contact with the aluminum frame position, improve the mold inside lamp panel heat distribution. Test: by improving measures after the light in the same drive power module can be glass straight under in‐plane horizontal arrows temperature reduced from 2.5 ℃ to 1.4 ℃, the improved white showing effect.