原子层沉积
原子单位
纳米技术
分解
氮化物
吸附
化学
电介质
比例(比率)
沉积(地质)
密度泛函理论
半导体
工程物理
材料科学
薄膜
计算化学
图层(电子)
物理化学
光电子学
物理
有机化学
量子力学
古生物学
沉积物
生物
标识
DOI:10.1088/0268-1242/27/7/074008
摘要
Published papers on atomic-scale simulation of the atomic layer deposition (ALD) process are reviewed. The main topic is reaction mechanism, considering the elementary steps of precursor adsorption, ligand elimination and film densification, as well as reactions with substrates (particularly Si and SiO2) and CVD-like decomposition at the surface. Density functional theory is the first principles method generally applied to these mechanistic questions. The most popular subject for modelling is the ALD of oxides and nitrides, particularly the high-k dielectrics HfO2, ZrO2 and Al2O3, due to their importance in semiconductor processing.
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