Jet impingement boiling heat transfer performance of refrigerant HP-1 in micro-pin-finned surfaces for high-power chips

• A compact jet impingement boiling heat transfer device achieves a high-powder cooling power of 1532 w. • The variation trends of critical heat flux , heat transfer coefficient and pressure drop with mass flux, saturated pressure and liquid subcooling are obtained. • Compared with smooth surface, a micro-pin-finned surface can increase CHF and HTC by up to 60 % and 32 %, while only increasing a pressure drop of 14 %. In this paper, jet impingement boiling heat transfer performance was studied using a novel new environmentally friendly refrigerant medium (HP-1) based on a high-power chip heat sink. A series of experimental investigations of jet impingement boiling were conducted on smooth and micro-pin-finned surfaces (PF0.5–0.5–1, PF0.5–0.5–2 and PF0.3–0.3–1). Heat transfer performances were evaluated over the saturated pressures from 450 to 590 kPa, liquid subcoolings from 2 to 15 K, nozzle sizes from 1 to 2 mm, mass fluxes from 71 to 858 kg/(m 2 s). The results show that critical heat flux (CHF) and heat transfer coefficient (HTC) increases with the increase of mass flux and saturated pressure. At ΔT sub =15 K, the CHF of the micro-pin-finned surfaces can be increased by 63 % compared with smooth surface, in which the CHF of PF0.5–0.5–2 surface is up to 1532 kW/m 2 . Boiling heat transfer coefficient first increases and then decreases with the increase of heat flux. Due to the increase of the inlet liquid subcooling, leading to a large temperature difference, so the heat transfer coefficient is smaller at a high liquid subcooling. Several factors, such as mass flux, saturated pressure and liquid subcooling, have a great impact on pressure drop. With the increase of vapor quality, the shear action between the vapor-liquid phase is enhanced, and the pressure drop will gradually increase. Bubble behaviors have also been captured by a high-speed camera to help analyze the mechanism of jet impingement boiling heat transfer in a confined space for high-power chips.