Wafer Level Pixelation of Colloidal Quantum Dot Image Sensors

Monolithic integration of colloidal quantum dot (CQD) thin-film on 200 mm CMOS wafers is demonstrated. Full pixelation of CQD thin-film photodiodes at wafer level is presented for the first time. We show a low-temperature process flow compatible with standard CMOS fab equipment. The self-aligned pixelation approach is an improvement over a conventional way of having a thin-film absorber layer on pixelated bottom electrodes, and it enables crosstalk reduction as well as multi-stack arrays.