Fast Fabrication of Flexible Functional Circuits Based on Liquid Metal Dual‐Trans Printing

Advanced MaterialsVolume 27, Issue 44 p. 7109-7116 Communication Fast Fabrication of Flexible Functional Circuits Based on Liquid Metal Dual-Trans Printing Qian Wang, Qian Wang Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 ChinaSearch for more papers by this authorYang Yu, Yang Yu Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084 ChinaSearch for more papers by this authorJun Yang, Jun Yang Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 ChinaSearch for more papers by this authorJing Liu, Corresponding Author Jing Liu Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 China Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084 ChinaE-mail: jliu@mail.ipc.ac.cnSearch for more papers by this author Qian Wang, Qian Wang Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 ChinaSearch for more papers by this authorYang Yu, Yang Yu Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084 ChinaSearch for more papers by this authorJun Yang, Jun Yang Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 ChinaSearch for more papers by this authorJing Liu, Corresponding Author Jing Liu Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190 China Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084 ChinaE-mail: jliu@mail.ipc.ac.cnSearch for more papers by this author First published: 28 September 2015 https://doi.org/10.1002/adma.201502200Citations: 210Read the full textAboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinkedInRedditWechat Graphical Abstract A dual-trans method to print the first functional liquid-metal circuit layout on poly(vinyl chloride) film, and then transfer it into a poly(dimethylsiloxane) substrate through freeze phase transition processing for the fabrication of a flexible electronic device. A programmable soft electronic band and a temperature-sensing module wirelessly communicate with a mobile phone, demonstrating the efficiency and capability of the method. Citing Literature Supporting Information As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Filename Description adma201502200-sup-0001-S1.pdf680.5 KB Supplementary adma201502200-sup-0002-S2.wmv15.5 MB Supplementary adma201502200-sup-0003-S3.wmv12.2 MB Supplementary Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article. Volume27, Issue44November 25, 2015Pages 7109-7116 RelatedInformation