材料科学
透射电子显微镜
锗
电阻率和电导率
基质(水族馆)
硅
分析化学(期刊)
扩散
结晶学
纳米技术
冶金
化学
地质学
工程类
物理
电气工程
海洋学
热力学
色谱法
作者
Dan Zhang,Jing Xu,Jianfeng Gao,Anyan Du,Jing Zhang,Shujuan Mao,Yang Men,Pengfei Liu,Shihai Gu,Xue Gang Luo,Yaodong Liu,Guilei Wang,Junfeng Li,Chao Zhao,Wenwu Wang,Dapeng Chen,Tianchun Ye,Jun Luo
标识
DOI:10.35848/1347-4065/ab922f
摘要
Co has been proposed as one of the most promising candidates to replace W or Cu in interconnects, where Co–Ti could be used as a single barrier/liner to prevent Co out-diffusion into dielectric and Si substrate as well as to enhance the adhesion property. In this paper, the material and electrical properties of Co/Co-Ti/n+-Si contacts with different compositions and thicknesses of Co–Ti, with and without Ge pre-amorphization implantation (Ge PAI) were investigated elaborately. Sheet resistance, phase formation, interfacial morphology and element distribution were comprehensively characterized in terms of four-point probe, X-ray diffraction and high-resolution transmission electron microscopy in combination with corresponding energy dispersive X-ray spectroscopy respectively. Meanwhile, the specific contact resistivity (ρc) was extracted using refined transmission line model structures, and it is found that Ge PAI is indeed beneficial in reducing ρc values in Co/Co-Ti/n+-Si contacts. With the assistance of Ge PAI, the lowest ρc value of 8.56 × 10−9 Ω cm2 is accomplished for Co/Co0.65Ti0.35/n+-Si contacts, which is a ∼47.8% reduction in contrast to that without Ge PAI.
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