无线
数码产品
晶体管
电气工程
柔性电子器件
电力电子
透明度(行为)
功率消耗
电子工程
计算机科学
CMOS芯片
工程类
功率(物理)
电信
电压
物理
量子力学
计算机安全
作者
Tilo Meister,Koichi Ishida,Corrado Carta,Niko Münzenrieder,Frank Ellinger
出处
期刊:IEEE Microwave Magazine
[Institute of Electrical and Electronics Engineers]
日期:2022-04-01
卷期号:23 (4): 24-44
被引量:5
标识
DOI:10.1109/mmm.2021.3136684
摘要
There is a practical gap between conventional rigid electronics and bendable items from daily life, such as paper, tape, textiles, and the human body. This space can be bridged by flexible transistor technologies, which typically offer bendability, a light weight, ultrathin dimensions, transparency, some stretchability, suitability for large areas, and a low cost. Thanks to the continuous increase of the maximal operation frequency of flexible electronics, wireless communication is becoming one of the promising enablers for many new applications and is widely studied. For a long time, electronics have advanced in terms of speed, power consumption, integration density, and cost. In particular, reductions in feature sizes, which lead to improvements in integration density, are expected to keep slowing down, e.g. due to thermal noise constraints. This trend has long been predicted, and it has motivated the investigation of multiple alternative electronic technologies, including mechanically flexible ones.
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