聚合物
材料科学
热导率
纳米复合材料
复合材料
聚合物纳米复合材料
热稳定性
纳米技术
化学工程
数码产品
导电聚合物
化学
工程类
物理化学
作者
Congliang Huang,Xin Qian,Ronggui Yang
标识
DOI:10.1016/j.mser.2018.06.002
摘要
Polymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the low thermal conductivity of polymers is one of the major technological barriers. Enhancing the thermal conductivity of polymers is important for these applications and has become a very active research topic over the past two decades. In this review article, we aim to: 1). systematically summarize the molecular level understanding on the thermal transport mechanisms in polymers in terms of polymer morphology, chain structure and inter-chain coupling; 2). highlight the rationales in the recent efforts in enhancing the thermal conductivity of nanostructured polymers and polymer nanocomposites. Finally, we outline the main advances, challenges and outlooks for highly thermal-conductive polymer and polymer nanocomposites.
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