A Wearable Ultrasonic Neurostimulator—Part II: A 2D CMUT Phased Array System With a Flip-Chip Bonded ASIC

电容式微机械超声换能器 专用集成电路 超声波传感器 电容感应 传感器 相控阵 倒装芯片 电气工程 材料科学 炸薯条 电子工程 工程类 光电子学 声学 物理 纳米技术 胶粘剂 图层(电子) 天线(收音机)
作者
Chunkyun Seok,Oluwafemi J. Adelegan,Ali Önder Biliroğlu,F. Yalcın Yamaner,Ömer Oralkan
出处
期刊:IEEE Transactions on Biomedical Circuits and Systems [Institute of Electrical and Electronics Engineers]
卷期号:15 (4): 705-718 被引量:8
标识
DOI:10.1109/tbcas.2021.3105064
摘要

A 2D ultrasonic array is the ultimate form of a focused ultrasonic system, which enables electronically focusing beams in a 3D space. A 2D array is also a versatile tool for various applications such as 3D imaging, high-intensity focused ultrasound, particle manipulation, and pattern generation. However, building a 2D system involves complicated technologies: fabricating a 2D transducer array, developing a pitch-matched ASIC, and interconnecting the transducer and the ASIC. Previously, we successfully demonstrated 2D capacitive micromachined ultrasonic transducer (CMUT) arrays using various fabrication technologies. In this paper, we present a 2D ultrasonic transmit phased array based on a 32 × 32 CMUT array flip-chip bonded to a pitch-matched pulser ASIC for ultrasonic neuromodulation. The ASIC consists of 32 × 32 unipolar high-voltage (HV) pulsers, each of which occupies an area of 250 $\mu$ m × 250 $\mu$ m. The phase of each pulser output is individually programmable with a resolution of $1/f_{\mathrm{C}}/16$ , where $f_{\mathrm{C}}$ is less than 10 MHz. This enables the fine granular control of a focus. The ASIC was fabricated in the TSMC 0.18- $\mu$ m HV BCD process within an area of 9.8 mm × 9.8 mm, followed by a wafer-level solder bumping process. After flip-chip bonding an ASIC and a CMUT array, we identified shorted elements in the CMUT array using the built-in test function in the ASIC, which took approximately 9 minutes to scan the entire 32 × 32 array. A compact-form-factor wireless neural stimulator system—only requiring a connected 15-V DC power supply—was also developed, integrating a power management unit, a clock generator, and a Bluetooth Low-Energy enabled microcontroller. The focusing and steering capability of the system in a 3D space is demonstrated, while achieving a spatial-peak pulse-average intensity ( $\mathrm{I_{SPPA}}$ ) of 12.4 and 33.1 W/ ${\rm cm^{2}}$ ; and a 3-dB focal volume of 0.2 and 0.05 ${\rm mm^{3}}$ —at a depth of 5 mm—at 2 and 3.4 MHz, respectively. We also characterized transmission of ultrasound through a mouse skull and compensated the phase distortion due to the skull by using the programmable phase-delay function in the ASIC, achieving 10% improvement in pressure and a tighter focus. Finally, we demonstrated a ultrasonic arbitrary pattern generation on a 5 mm × 5 mm plane at a depth of 5 mm.
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