Aminoquinoline-functionalized fluorographene quantum dots for low-temperature curable and low-dielectric photosensitive polyimide nanocomposites

Photosensitive polyimide (PSPI) is widely used in the electronic packaging of integrated circuits (IC), organic light-emitting diodes (OLED), and optoelectronic devices. However, low-temperature curable and low-dielectric PSPI is currently required to meet new applications in electronic packaging. Herein, a multifunctional aminoquinoline-functionalized fluorographene quantum dots (QL-FGQDs) nanofiller is carefully designed to achieve these goals. The results demonstrated that the in-situ polymerized QL-FGQDs/PI nanocomposites cured at 200 °C exhibit a low dielectric constant (Dk) of [email protected] MHz and a dissipation factor (Df) of [email protected] MHz. In addition, the nanocomposites also have excellent optical, mechanical, and thermal properties (the transmittance at 550 nm is above 90%, Young's modulus is 2.95 GPa, and T5% can achieve as high as 517.2 °C), which are better than those of pure PI cured at 300 °C. Furthermore, QL-FGQDs are demonstrated to be applied as a nanofiller for PSPI with a high resolution of 3 μm under an exposure light of 365 nm. Therefore, QL-FGQDs nanofiller and PI nanocomposites exhibit excellent application potential in next-generation electronic packaging.