引线框架
铅(地质)
制作
帧(网络)
材料科学
引线键合
电子包装
模具(集成电路)
机械工程
炸薯条
电气工程
工程类
纳米技术
复合材料
图层(电子)
地质学
半导体器件
病理
地貌学
替代医学
医学
出处
期刊:Elsevier eBooks
[Elsevier]
日期:2017-01-01
被引量:2
标识
DOI:10.1016/b978-0-12-803581-8.02023-3
摘要
In the electronic industry, lead frames are metal structures inside an integrated chip package that allow the transfer of signal from the die to the board. The die inside the package is attached to the lead frame, while bond wires attach the die pads to the leads. To allow for better conductivity, lead frames are usually made of copper alloys. Fabrication of the lead frames along with their property and performance requirements are discussed in this article.
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