石墨烯
材料科学
腐蚀
热导率
钝化
复合材料
纳米复合材料
铜
界面热阻
热阻
冶金
图层(电子)
纳米技术
热的
物理
气象学
作者
Fangzhao Pu,Cheng Zhou,Pan Liang,Yiming Bai,Ge Wang,Zhimao Yang,Chuncai Kong
标识
DOI:10.1016/j.diamond.2023.110193
摘要
Graphene is expected to comprehensively improve the thermal conductivity and corrosion resistance of metals to satisfy the need of adverse electrochemical environments. However, there are some major concerns in the mixing methods such as, low quality of graphene, non-uniform dispersion, and poor interface bonding with the metal matrix. In this study, we propose an effective approach to fabricate Cu-graphene (Cu/G) nanocomposite by sintering in-situ growth of graphene on Cu nanoparticles. Results confirmed the firmly adhesive graphene on Cu surface, which closely linked Cu particles to building a bulk, particularly binding between Cu particles and graphene flakes is largely improved by the sintered progress. The as-prepared Cu/G heat spreader demonstrated higher thermal conductivity (376 W/(m·K) at room temperature and lower thermal expansion. Additionally, the short-time corrosion resistance showed that Cu/G can build a graphene network to avoid the penetration of active species and enhance the passivation layer. This work endows Cu/G integral materials possessing good thermal conductivity and corrosion inhibition, which can effectively serve as potential offshore materials.
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