合金
材料科学
介电谱
导电体
扩散
腐蚀
冶金
电化学
复合材料
分析化学(期刊)
电极
化学
物理化学
色谱法
热力学
物理
作者
Xiang Leng,Yadong Zhang,Qiong Zhou,Ying‐Hui Zhang,Zhigang Wang,Hang Wang,Bin Yang
标识
DOI:10.1088/2053-1591/aac277
摘要
The semi-conductive properties of passive films formed on Cu-Ni alloy and Cu-Ni-La alloy were investigated in 0.1 M NaOH solution, by employing electrochemical impedance spectroscopy (EIS), Mott–Schottky analysis and point defect model (PDM). Results indicate that both the passive films formed on Cu-Ni alloy and Cu-Ni-La alloy display p-type semi-conductive characteristics with cation vacancies in order of magnitude of 1020 cm3. Compared with Cu-Ni alloy, La addition could significantly improve the corrosion resistance, due to a superior barrier passive film formed Cu-Ni-La alloy with a bigger film resistance (R f), increased passive film thickness (L ss) in conjunction with decreased diffusion coefficient (D 0).
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