材料科学
晶界
晶界强化
空隙(复合材料)
晶界扩散系数
电子背散射衍射
烧结
复合材料
可塑性
打滑(空气动力学)
冶金
微观结构
热力学
物理
作者
Wei Wang,Daniel S. Balint,A. A. Shirzadi,Yaping Wang,Junyi Lee,Lee Aucott,Jun Jiang
标识
DOI:10.1016/j.actamat.2023.119103
摘要
Understanding the interaction of micro-voids and grain boundaries is critical to achieving superior mechanical properties for safety-critical parts. Micro-voids and grain boundaries may interact during advanced manufacturing processes such as sintering, additive manufacturing and diffusion bonding. Here, we show imparted benefits on mechanical properties by achieving grain boundary migration across voids. The micro-mechanisms and quantitative analysis of grain boundary migration on local deformation were studied by integrated in-situ EBSD/FSE and crystal plasticity finite element modelling. It is revealed that a migrated grain boundary does not alter the activated slip systems but precludes grain boundary-multislip interaction around interfacial voids to alleviate stress concentrations. The stress mitigation caused by grain boundary migration is almost the same as that caused by void closure under the example diffusion bonding thermal-mechanical process used in this study. This new understanding sheds light on the mechanistic link between GND hardening, grain boundary migration and the corresponding material tensile behaviour. It opens a new avenue for achieving superior mechanical properties for metallic parts with micro-defects such as those generated in diffusion-bonded, sintered and additive manufactured components.
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