0D/2D Co-Doping Network Enhancing Thermal Conductivity of Radiative Cooling Film for Electronic Device Thermal Management

The radiative cooling has great potential for electronic device cooling without requiring any energy consumption. However, a low thermal conductivity of most radiative cooling materials limits their application. Herein, a multishape codoping strategy was proposed to achieve collaborative enhancement of thermal conductivity and radiative properties. The hBN-coated hollow SiO