Polymer‐Assisted Metal Deposition (PAMD): A Full‐Solution Strategy for Flexible, Stretchable, Compressible, and Wearable Metal Conductors

Metal interconnects, contacts, and electrodes are indispensable elements for most applications of flexible, stretchable, and wearable electronics. Current fabrication methods for these metal conductors are mainly based on conventional microfabrication procedures that have been migrated from Si semiconductor industries, which face significant challenges for organic‐based compliant substrates. This Research News highlights a recently developed full‐solution processing strategy, polymer‐assisted metal deposition (PAMD), which is particularly suitable for the roll‐to‐roll, low‐cost fabrication of high‐performance compliant metal conductors (Cu, Ni, Ag, and Au) on a wide variety of organic substrates including plastics, elastomers, papers, and textiles. This paper presents i) the principles of PAMD, and how to use it for making ii) flexible, stretchable, and wearable conductive metal electrodes, iii) patterned metal interconnects, and d) 3D stretchable and compressible metal sponges. A critical perspective on this emerging strategy is also provided.