物理气相沉积
离子镀
材料科学
溅射
薄膜
涂层
电子束物理气相沉积
溅射沉积
沉积(地质)
基质(水族馆)
化学气相沉积
纳米技术
生物
海洋学
地质学
古生物学
沉积物
作者
Sheila Shahidi,Bahareh Moazzenchi,M. Ghoranneviss
出处
期刊:European Physical Journal-applied Physics
日期:2015-08-27
卷期号:71 (3): 31302-31302
被引量:71
标识
DOI:10.1051/epjap/2015140439
摘要
Physical vapor deposition (PVD) is a coating process in which thin films are deposited by the condensation of a vaporized form of the desired film material onto the substrate. The PVD process is carried out in a vacuum. PVD processes include different types, such as: cathode arc deposition, electron beam physical vapor deposition, evaporative deposition, sputtering, ion plating and enhanced sputtering. In the PVD method, the solid coating material is evaporated by heat or by bombardment with ions (sputtering). At the same time, a reactive gas is also introduced; it forms a compound with the metal vapor and is deposited on the substrate as a thin film with highly adherent coating. Such coatings are used in a wide range of applications such as aerospace, automotive, surgical, medical, dyes and molds for all manner of material processing, cutting tools, firearms, optics, thin films and textiles. The objective of this work is to give a comprehensive description and review of the science and technology related to physical vapor deposition with particular emphasis on their potential use in the textile industry. Physical vapor deposition has opened up new possibilities in the modification of textile materials and is an exciting prospect for usage in textile design and technical textiles. The basic principle of PVD is explained and the major applications, particularly sputter coatings in the modification and functionalization of textiles, are introduced in this research.
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