胶粘剂
薄脆饼
材料科学
复合材料
债券
晶片键合
光电子学
财务
图层(电子)
经济
作者
Alain Phommahaxay,Atsushi Nakamura,Anne Jourdain,Greet Verbinnen,Yoshitaka Kamochi,Ichiro Koyama,Yu Iwai,Mitsuru Sawano,Shiro Tan,Andy Miller,Gerald Beyer,Erik Sleeckx,Eric Beyne
标识
DOI:10.1109/ectc.2015.7159785
摘要
Among the technological developments pushed by the emergence of 3D-ICs, wafer thinning has become a key element in device processing over the past years. As technology matures, more emphasis is now being put on the overall cost of ownership, which is still regarded as a refraining element for technology adoption. Therefore novel temporary bond concepts and materials are being explored to further bring down the process complexity and cost.
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