Polymeric Materials for Electronics Packaging and Interconnection

An overview of the driving forces for the increased importance of packaging and interconnection to progress in electronics is presented, with emphasis on the influence and importance of the role of polymers. Relevant information on market values for components is included, where appropriate. In addition, trends in interconnection and packaging, their combined role, and their market size are discussed. Examples are given in which plastic packaging can lead to substantial reductions in packaged IC cost. An extensive overview of polymer applications is presented, with special emphasis on thin films, protective gels, rigid encapsulants, and printed wiring board materials and processes. The chapter also indicates why the symposium and the book are timely and important, especially for those interested in the chemical aspects of these materials.