High thermal conductivity Cu-3Cr/Diamond composites fabricated by powder metallurgy

Cu-3Cr/Diamond composites with different diamond sizes(80, 100, 150, 400 μm)and different volume fractions(30 vol%-70 vol%)were fabricated by powder metallurgy and hot-pressing sintering. Cr23C6 transition layer was detected at the interface between the diamond and the matrix, with a thickness of around 1 µm. The generation of chromium carbide strengthened the interfacial bonding between diamond and matrix. The thermal conductivity of Cu-3Cr/50Dia composites could reach 714 W/m·K when the diamond size was 400 μm. The high thermal conductivity was due to the chromium carbide forming at the interface, which increased thermal transmission between the diamond and the matrix.