材料科学
复合数
复合材料
热导率
填料（材料）
热的
物理
气象学
作者
Xian-Ming Bai,Yuhang Meng,Fanyu Zhou,Chen Ge,Dazhi Sun,Dehong Yang,Xiangfen Jiang,Pengcheng Dai,Xuebin Wang
摘要
The issue of heat accumulation caused by the low thermal conductivity (TC) of polymers widely used in electronic devices has become a block for chip development. Enhancing the overall TC...
科研通智能强力驱动
Strongly Powered by AbleSci AI
Singularity
不配.
穆紫
坚强的广山
互助遵法尚德
paparazzi221
lch23560
带头大哥
Yziii
HEIKU
寻道图强
Leonardi
好困
zho
shinysparrow
pcr163
夏远航
InfoNinja
子车茗
pluto
皖公网安备34019202002308
