Study on the Influence of Cupric Sulphate Concentration on Copper Nanoparticle Prepared by Electrochemical Method

Nanometer-sized copper particles have been prepared by electrochemical method in emulsion containing sodium dodecyl sulfate, tween 80, dodecyl mercaptan, and different concentration of cupric sulphate. X-ray diffraction, transmission electron microscopy, and Fourier transform infrared spectroscopy were carried out to investigate and characterize as-prepared copper particles. The results show that the particle size, dispersibility, and particle size distribution of as-prepared copper particles were significantly influenced by the concentration of cupric sulphate. As the concentration of cupric sulphate was increased from 0.04 to 0.10 mol/L, the ionization property of surfactant was bated and then its electric exclusion force was also decreased by cupric sulphate, resulting in the dissolved quantity of polar organic compound is relatively reduced in emulsion. Therefore, some copper particles were oxidized in higher concentration of cupric sulphate. It can be found that the copper nanoparticles had smaller average particle size (12 nm), better dispersibility, and narrow particle size distribution while the concentration of cupric sulphate was 0.04 mol/L.