New polyimide-polyoxometalate nanocomposite materials with nanoporous structure and ultra-low dielectric constant, formed in supercritical carbon dioxide

Vinyltrimethoxysilane interaction with K8(SiW11O39) obtained polyoxometalate (Bu4N)4[SiW11O39{(CH2 = CH-Si)2O}](SiW11-CH = CH2). Synthesized two new fluorinated aromatic polyimide in two stages with a dielectric constant (k) in the range 2.70-2.75. On the basis of poly(amic acids) and a mixture of thermal imidization polyoxometalate obtained polyimide/polyoxometalate composite film. It was found that with increasing polyoxometalate in a mixture of 0 to 20 wt% the dielectric constant decreases from 2,75 to 1,70. Nanoporous materials with ultra-low dielectric constant in the range 1.31-1.64 in combination with high thermal (T10% = 536-570°C in N2) and mechanical characteristics using supercritical carbon dioxide have been developed on the basis of the obtained polyimide/polyoxometalate composite films.