热导率
热电材料
非谐性
塞贝克系数
材料科学
联轴节(管道)
凝聚态物理
热电效应
结晶学
物理
化学
冶金
热力学
复合材料
作者
Han-Pu Liang,Songyuan Geng,Tiantian Jia,Chuan-Nan Li,Xun Xu,Xie Zhang,Su‐Huai Wei
出处
期刊:Physical review
[American Physical Society]
日期:2024-01-24
卷期号:109 (3)
被引量:11
标识
DOI:10.1103/physrevb.109.035205
摘要
Cu chalcopyrites exhibit excellent thermoelectric performance because of their high thermopower and low thermal conductivity. Conversely, despite that Ag chalcopyrites have even lower thermal conductivity than the Cu-based ones, they generally display lower thermoelectric performance. The underlying physics for the thermoelectric disparity between Cu- and Ag-based materials remains unclear. In this work we investigate thermal transport and thermopower of ternary $AM{\mathrm{Se}}_{2}$ chalcopyrites $(A=\mathrm{Cu}/\mathrm{Ag}; M=\mathrm{Ga}/\mathrm{In})$ using first-principles methods. We reveal that strong anharmonicity from $s\ensuremath{-}d$ coupling leads to low thermal conductivity in Cu as well as Ag chalcopyrites, whereas weaker bond strength and heavier atomic mass contribute to even lower thermal conductivity in Ag chalcopyrites than the Cu ones. On the other hand, Cu chalcopyrites show superior thermopower owing to their higher band degeneracy and stronger $p\ensuremath{-}d$ coupling, which leads to enhanced mobility. We conclude that if Ag chalcopyrites could reach comparable hole concentrations as in Cu chalcopyrites, high thermoelectric performance in Ag chalcopyrites can also be achieved because of their low thermal conductivity. Understanding the disparity between Cu and Ag chalcogenides from a mechanistic perspective is important for future design of superior thermoelectric materials.
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