Printing Functional 3D Microdevices by Laser‐Induced Forward Transfer

Slender, out-of-plane metal microdevices are made in a new spatial domain, by using laser-induced forward transfer (LIFT) of metals. Here, a thermocouple with a thickness of 10 µm and a height of 250 µm, consisting of platinum and gold pillars is demonstrated. Multimaterial LIFT enables manufacturing in the micrometer to millimeter range, i.e., between lithography and other 3D printing technologies. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.