材料科学
电磁屏蔽
导电体
复合数
复合材料
电磁干扰
聚合物
热的
电磁干扰
导电聚合物
抗静电剂
热导率
电气工程
图层(电子)
物理
气象学
工程类
作者
Yong Liu,Shu Wang,Qianxiang Wang,Xiaofeng Li,Ning Zhao,Zhong‐Zhen Yu,Jian Xu
标识
DOI:10.1021/acsami.4c15374
摘要
Robust polymer-based composites with high thermal conductivity (TC) and electromagnetic interference shielding effectiveness (EMI SE) hold great promise for applications in rapidly developing electronics. Traditional composites containing inorganic fillers often suffer from increases in processing difficulty, density, and significant deterioration in mechanical properties. Herein, we report for the first time a flexible multilayered all-polymer composite of poly(
科研通智能强力驱动
Strongly Powered by AbleSci AI