Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink‐jet printing

ABSTRACT A novel solder resist ink for inkjet printing containing the ultraviolet (UV) and thermal dual curing oligomer is introduced in this work. Three kinds of acrylic monomers for the synthesis of the oligomer are successful prepared and their structures are determined by Fourier transfer infrared. Both UV curing process and thermostability are monitored under UV differential scanning calorimetry and thermogravimetric analysis. For the photoreaction process, the oligomer using Lauryl methacrylate as the material of copolymerization possesses the highest reactivity and conversion of carbon–carbon double bond. Besides, this kind of oligomer also owns excellent thermostability, just losing 5.9% of its weight at 288 °C. The solder resist inks containing the oligomers and jetting by the inkjet printer are tested with the adhesion, soldering resistance, and other performances, presenting the outstanding heat resistance and wide application prospects. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136 , 47428.