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146 积分 2023-10-31 加入
The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
27天前
已完结
Simultaneously enhancing the strength and ductility of Cu-Ti-Fe alloy through electric current pulse induced precipitation
27天前
已完结
The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
1个月前
已完结
Influencing mechanisms of melt behavior on metal vapor characteristic and columnar grain formation in wire-arc directed energy deposition of titanium alloy
1个月前
已完结
Perovskite Light‐Emitting Diodes with an External Quantum Efficiency Exceeding 30%
1个月前
已完结
In-situ compression tests and analysis of strength-ductility synergy in heterogeneous structured copper-tin composite joint
2个月前
已完结
Revealing the strengthening mechanism of Cu–Sn composites joint fabricated via in-situ reaction for power electronic packaging
2个月前
已完结
激光选区熔化AlSi10Mg-0.6Er-0.4Zr成形组织及性能研究
2个月前
已完结
Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in CujSnAg3.0Cu0.5jCu lap-type interconnects
3个月前
已完结
High strength and electrical conductivity of nanostructured Cu–1Cr–0.1Zr alloy processed by multi–stage deformation and aging
3个月前
已完结
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