Lv11
40 积分 2023-08-21 加入
Improvement of Silver-Sintered Die Bonding of SiC/DBC Power Modules Through Backside Metallization With High-Density (111) Orientation Ag Nanotwinned Films
2小时前
已关闭
Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering
2个月前
已完结
Chlorine and Sulfur Effects on Gold-Aluminum Wire Bond Reliability
7个月前
已关闭
Specific Features of the Contact Corrosion of Aluminum and Copper in NaCl Solutions
7个月前
已完结
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints
9个月前
已完结
Deployment of vapour chambers for electronic heat dissipation: state-of-the-art
1年前
已完结
THE SKILLS FOR MEASURING THE EFFECTIVE THERMAL DIFFUSION CONDUCTIVITY OF THE VAPOR CHAMBER WITH THE ÅNGSTRÖM THEORY
1年前
已完结
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