Lv1
40 积分 2023-08-21 加入
Regulation of copper electrodeposition and its application in chip manufacturing
2小时前
求助中
Improvement of Silver-Sintered Die Bonding of SiC/DBC Power Modules Through Backside Metallization With High-Density (111) Orientation Ag Nanotwinned Films
2个月前
已关闭
Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering
5个月前
已完结
Chlorine and Sulfur Effects on Gold-Aluminum Wire Bond Reliability
10个月前
已关闭
Specific Features of the Contact Corrosion of Aluminum and Copper in NaCl Solutions
10个月前
已完结
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints
1年前
已完结
Deployment of vapour chambers for electronic heat dissipation: state-of-the-art
1年前
已完结
THE SKILLS FOR MEASURING THE EFFECTIVE THERMAL DIFFUSION CONDUCTIVITY OF THE VAPOR CHAMBER WITH THE ÅNGSTRÖM THEORY
1年前
已完结
皖公网安备34019202002308
