Lv11
48 积分 2023-11-20 加入
Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: microstructure, resistivity, oxidation resistance, and long-term stability
6小时前
已完结
Study on Preparation and Application of Nano-copper Powder for Power Semiconductor Device Packaging
10个月前
已完结
Study on the Resistivity and Porosity of Nano Copper Powder Under Low-Temperature Sintering without Pressure
10个月前
已完结
Reduction Behavior of Surface Oxide on Submicron Copper Particles for Pressureless Sintering Under Reducing Atmosphere
10个月前
已完结
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
10个月前
已完结
Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging
10个月前
已完结
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
10个月前
已完结
A rapid-sintering Cu-Cu joints with ultrahigh shear strength and super reliability for power electronics package
11个月前
已完结
Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging
11个月前
已完结
Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles
11个月前
已关闭
Fenestration of Lamina Terminalis During Anterior Circulation Aneurysm Clipping on Occurrence of Shunt-Dependent Hydrocephalus After Aneurysmal Subarachnoid Hemorrhage: Meta-Analysis
1年前
已采纳
The miR-124-AMPAR pathway connects polygenic risks with behavioral changes shared between schizophrenia and bipolar disorder
1年前
已采纳
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