Lv41
570 积分 2024-03-04 加入
Experimental and computational analyses on residual stress of composite plate using DIC and Hole-drilling methods based on Mohr's circle and considering the time effect
7天前
已完结
Warpage Analysis of Silicon Wafer in Ingot Slicing by Wire-Saw Machine
14天前
已完结
Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry
21天前
已完结
A Study on Material Removal Caused by Phase Transformation of Monocrystalline Silicon During Nanocutting Process via Molecular Dynamics Simulation
22天前
已完结
Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon
22天前
已完结
Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry
23天前
已完结
Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon
23天前
已完结
Invention and Technological Progresses of Integrated Circuits
24天前
已完结
Computational analysis of electronic structure and optical properties of monocrystalline silicon-vacancy defect system based on density functional theory
24天前
已完结
Study on the effect of diamond wire saw-cutting process parameters on brittle cracks in monocrystalline silicon
24天前
已完结
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