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90 积分 2023-12-11 加入
Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
11个月前
已完结
Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate
11个月前
已完结
3D Interdigital Electrodes Dielectric Capacitor Array for Energy Storage Based on Through Glass Vias
11个月前
已完结
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