Lv4
450 积分 2021-09-08 加入
Cold Split Kerf-Free Wafering Results for Doped 4H-SiC Boules
24天前
已完结
Laser Assisted SiC Wafering Using COLD SPLIT
24天前
已完结
New laser slicing technology named KABRA process enables high speed and high efficiency SiC slicing
24天前
已完结
Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
25天前
已完结
Modulation of ultrafast laser-induced modified structure inside silicon carbide for thin wafer dicing
25天前
已完结
Electronic, Magnetic, and Optical Performances of Non-Metals Doped Silicon Carbide
2个月前
已完结
Doping Effect of Anthraquinone-Based Sulfate on the Supercapacitive Performance of Metal–Organic Framework/Polypyrrole Composites
6个月前
已完结
Supercapacitive behavior depending on the mesopore size of three-dimensional micro-, meso- and macroporous silicon carbide for supercapacitors
7个月前
已完结
Preparation of high-performance supercapacitors from waste polyurethane-based hierarchical porous carbon
7个月前
已完结
Flexible solid-state supercapacitors based on freestanding nitrogen-doped porous carbon nanofibers derived from electrospun polyacrylonitrile@polyaniline nanofibers
7个月前
已完结
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