Lv1
40 积分 2023-11-02 加入
Organic Interposer CoWoS-R+ (plus) Technology
1个月前
已完结
Studies of Fluorine-Induced Corrosion and Defects on Microchip Al Bondpads and Elimination Solutions
2个月前
已关闭
Ka-Band AiP Array in Mold-on-Mold FOWLP technology
3个月前
已完结
Broadband Fan-out Phased Antenna Array at 28 GHz for 5G Applications
3个月前
已完结
A Low-Profile, Scalable 28-GHz Phased Array Antenna in Fan-Out Wafer-Level Package for 5G Communication
3个月前
已完结
A Wideband mmWave Antenna in Fan-Out Wafer Level Packaging With Tall Vertical Interconnects for 5G Wireless Communication
3个月前
已完结
Dual Polarized FOWLP AiP for 5G Base Station Applications
3个月前
已完结
Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP
3个月前
已完结
Package Design Optimization of Thin Mold Double Side System in Package (DS-SIP)
3个月前
已完结
An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics
4个月前
已完结
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