Lv3
236 积分 2023-11-17 加入
Electroless plating of copper on carbon fiber surfaces and corresponding mechanism
1个月前
已完结
Morphology Control and Mechanism of Different Bath Systems in Cu/SiCw Composite Electroplating
1个月前
已完结
Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application
1个月前
已完结
CuxS particles loaded on S-doped 3D hierarchical porous carbon as an efficient electrode for superior asymmetric supercapacitors
1个月前
已完结
Engineering FeSe2 Encapsulated within Carboxymethylcellulose-Derived Porous Carbon for Enhanced Surface Reaction Kinetics in Li-Ion Half/Full Battery Anodes
1个月前
已完结
Three-Dimensional Porous Carbon-Supported Co/Fe Bimetallic Nanoparticles Derived from Carboxymethyl Cellulose for Enhanced Supercapacitor Electrodes
1个月前
已完结
Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards
1个月前
已完结
In situ fabrication of Ni(OH)2/Cu2O nanosheets on nanoporous NiCu alloy for high performance supercapacitor
2个月前
已完结
MnO2 Films deposited on CuO nanomaterials as electrode materials for supercapacitors
2个月前
已完结
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