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丁丁峥
Lv1
80 积分
2024-06-21 加入
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Modification of the Preston equation for the chemical–mechanical polishing of copper
27天前
已完结
Study of Non-Preston Phenomena Induced from the Passivated Additives in Copper CMP
27天前
已完结
Role of the Functional Groups of Complexing Agents in Copper Slurries
28天前
已完结
Effect of Ammonium Citrates as an Auxiliary Complexing Agent in TSV Copper Film CMP
29天前
已完结
Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing
29天前
已完结
Experimental and computational studies on TAD as an additive of copper chemical mechanical polishing
29天前
已完结
Effect of Ammonium Citrates as an Auxiliary Complexing Agent in TSV Copper Film CMP
1个月前
已完结
Chemical-mechanical synergies effects of multi-purpose pH regulators on C-, A-, and R-plane sapphire polishing
1个月前
已完结
Study on the surface interaction mechanism, corrosion inhibition effect and the synergistic action of potassium oleate and fatty alcohol polyoxy ethylene ether on copper film chemical mechanical polishing for giant large scale integrated circuit
2个月前
已完结
The synergy and DFT study of TT-LYK and potassium oleate on chemical mechanical polishing of cobalt in alkaline medium
2个月前
已完结
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