Lv3
218 积分 2022-03-17 加入
PDMS tri-block copolymers bearing quaternary ammonium salts for epidermal antimicrobial agents: Synthesis, surface adsorption and non-skin-penetration
3天前
已完结
Uncovering the Dissociative Adsorption of the Leveler Janus Green B on Cu Electrodes at the Molecular Level
19天前
已完结
Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper
1个月前
已完结
Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system
1个月前
已关闭
Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper
3个月前
已完结
Emerging trends and obstacles in Damascus processing and electroplating for Chiplet industries: A review
4个月前
已完结
Using a triblock copolymer as a single additive in high aspect ratio through silicon via (TSV) copper filling
4个月前
已完结
Research progress on additives and mechanism of copper electroplating for TSV
5个月前
已完结
Investigation of azathioprine and its local-structure molecules as levelers for through-holes copper electroplating
5个月前
已完结
Through glass via (TGV) copper metallization and its microstructure modification
6个月前
已完结
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