Lv32
306 积分 2023-10-25 加入
Comparative analysis of microlens array formation in fused silica glass by laser: femtosecond versus picosecond pulses
3天前
已完结
Wafer bonding : applications and technology
4天前
已完结
Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis
4天前
已完结
Preparation and characterization of UV-curable composite containing nano silica for glass-to-glass bonding
7天前
已完结
HF-free and fast fabrication of long, rectangular microchannels in fused silica: Novel femtosecond laser irradiation geometry
24天前
已完结
Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
1个月前
已完结
Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements
1个月前
已完结
Navigating Complex Process and Design Challenges in Hybrid Bonding for Advanced Semiconductor Integration: A Comprehensive Analysis
1个月前
已完结
Nano-FTIR spectroscopy reveals SiO2 densification within fs-laser induced nanogratings
1个月前
已完结
Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching
1个月前
已完结
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