Lv1
40 积分 2024-06-13 加入
Strengthening mechanism of Si, V and Ti atoms to the Ag/AlN interface: a study from first-principles calculations
13小时前
已完结
Interfacial reactions in actively brazed Cu-Al2O3 composites and copper using a newly developed Cu-Sn-Ag-Ti filler alloy
2个月前
已完结
MATERIAL PROPERTIES ANALYSIS OF CIRCUIT SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION OF SAPPHIRE (alpha-Al203) AND SILICON NITRIDE (Si3N4) USING CRYOGENIC CYCLING
3个月前
已关闭
Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder
6个月前
已完结
Direct Deposition of Graphene on Metal Substrates by Plasma Enhanced Chemical Vapor Deposition for Transparent Electrode Applications
6个月前
已关闭
Bonding and Integration of Silicon Carbide Based Materials for Multifunctional Applications
6个月前
已完结
皖公网安备34019202002308
