Lv1
60 积分 2024-04-08 加入
Statistical study of the influence of some variables on cobalt electrowinning
2小时前
已完结
Effects of Oximes on the Electrodeposition of Cobalt for Interconnect Applications
2个月前
已关闭
Determination of the Diffusion Coefficient in Electrodeposition Reactions by Electrochemical Impedance Spectroscopy: A Case Study of Cobalt in Molten LiCl-KCl Salt
2个月前
已完结
Effects of Accelerator Alkyl Chain Length on the Microvia Filling Performance in Copper Superconformal Electroplating
4个月前
已完结
Investigation of Cu/TaN and Co/TaN Barrier-Seed Oxidation by Acidic and Alkaline Copper Electroplating Chemistry for Damascene Applications
5个月前
已完结
Electrochemical Behavior and Analysis of Organic Additives in Sub 14nm Copper Damascene Plating Baths
5个月前
已关闭
Damascene Copper Plating Recipe Engineering for Defectivity, Health of Line (HOL) and Reliability Improvement
5个月前
已关闭
Bottom-up Filling of Damascene Trenches with Cobalt By Electroplating Process
5个月前
已关闭
Superconformal Film Growth: Mechanism and Quantification
6个月前
已完结
Effect of Dimethylglyoxime on Cobalt Bottom-up Filling
7个月前
已关闭
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