Lv11
50 积分 2024-09-14 加入
Surface treatment of aluminum oxide and tungsten carbide powders by ion beam sputter deposition
19天前
已完结
Magnetic and microwave absorbing properties of Co–Fe thin films plated on hollow ceramic microspheres of low density
19天前
已完结
Additively manufactured metallic biomaterials
2个月前
已完结
Recent advancements in hybrid additive manufacturing of similar and dissimilar metals via laser powder bed fusion
2个月前
已完结
Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate
2个月前
已完结
Cu Particles Reinforced Sn58bi Filler for Soldering Sic to Cu at a Temperature Below 200℃
2个月前
已完结
Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint
2个月前
已完结
Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations
2个月前
已完结
Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism
2个月前
已完结
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